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Edge211 Dual Pin Electronics Driver
TEST AND MEASUREMENT PRODUCTS Description
The Edge211 is a dual trinary driver manufactured in a wide voltage CMOS process. It is designed for automatic test equipment and instrumentation where cost, functional density, and power are all at a premium. Each tristatable driver is capable of generating 3 levels one for a logic high, one for a logic low, and one for either a termination voltage or a special programming voltage. The Edge211 is intended to offer an extremely low leakage, low cost, low power, small footprint, driver solution for 100 MHz and below pin electronics applications.
Features
* * * * * * * 100 MHz Operation 12V I/O Range Programmable Output Levels Flex In digital Inputs (Technology Independent) Three Level Driver Extremely Low Leakage Currents (~0 nA) Small Footprint (32 Pin, 7 mm X 7 mm, TQFP Package)
Applications
* Low Cost Automated Test Equipment
Functional Block Diagram
VH0 VTT0 VL0
DATA0 DATA0* DOUT0 DVR EN0 DVR EN0*
VTT EN0 VTT EN0*
VTT EN1 VTT EN1*
DVR EN1 DVR EN1* DOUT1 DATA1 DATA1*
VH1 VTT1 VL1
Revision 6 / February 28, 2005
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Edge211
TEST AND MEASUREMENT PRODUCTS PIN Description
Pin Name DATA0 / DATA0* DATA1 / DATA1* DVR EN0 / DVR EN0* DVR EN1 / DVR EN1* VTT EN0 / VTT EN0* VTT EN1 / VTT EN1* DOUT0 DOUT1 VH0, VH1 VL0, VL1 VTT0, VTT1 Power Supplies VCC0 VCC1 VEE0 VEE1 3, 22, 27 6, 14, 19 4, 21, 28 5, 13, 20 Positive analog power supply. Pin * 30, 29 11, 12 32, 31 9, 10 2, 1 7, 8 23 18 24, 17 25, 16 26, 15 Description Digital input that determines the high/low status of the driver when it is enabled. Digital input that enables and disables the driver, or places the driver in the VTT state. Digital input that determines whether DVR EN* places the driver in a high impedance state or actively drives to the VTT level. Driver output.
Unbuffered analog inputs that set the voltage level of a logical 1, 0, or VTT at the driver output.
Negative analog power supply.
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Edge211
TEST AND MEASUREMENT PRODUCTS PIN Description (continued)
DVR EN0*
DVR EN0
DATA0*
DATA0
VCC0
VEE0
VTT0
25 VTT EN0* VTT EN0 VCC0 VEE0 VEE1 VCC1 VTT EN1 VTT EN1* 9 17 1 VH0 DOUT0 VCC0 VEE0 VEE1 VCC1 DOUT1 VH1
DATA1*
DATA1
DVR EN1
DVR EN1*
VCC1
VEE1
VTT1
32 Pin, 7 mm X 7 mm, TQFP Package
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VL1
VL0
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Edge211
TEST AND MEASUREMENT PRODUCTS Circuit Description
Driver Description The Edge211 supports three distinct programmable driver levels - high, low, and termination, along with high impedance. There are no restrictions between any of these three levels in that all three may vary independently over the entire operating voltage range between VCC and VEE. Digital Inputs
1 1 X X X 0 1 VTT VL VH
Using the logic levels defined in Table 1, driver functionality is described in Table 2.
DVR EN* 1 VTT EN 0 DATA X DOUT HiZ
All digital inputs are wide voltage comparator inputs, and are therefore technology independent. The Edge211 may be driven by TTL, ECL, CMOS, or any custom level circuitry.
DATA DATA*
0 0
Table 2.
DVR EN* DVR EN
VTT EN VTT EN*
Figure 1. Driver Digital Inputs
Do NOT leave any driver digital inputs floating. The DVR EN*, DATA, and VTT EN are digital input pins that can be used to control the driver output level displayed at the DOUT pin. DVR EN, DATA*, and VTT EN* can be connected to a reference voltage which defines the logic triggering level. The relationship between the driver control pins and their corresponding logic levels can be seen in Table 1.
Input Voltage VDATA > VDATA* VDATA < VDATA* VDVR EN > VDVR EN* VDVR EN < VDVR EN* VVTT EN > VVTT EN* VVTT EN < VVTT EN* Corresponding Logic Level DATA = 1 DATA = 0 DVR EN* = 0 DVR EN* = 1 VTT EN = 1 VTT EN = 0
Note that DVR EN* determines whether the driver output state will be controlled by the VTT EN or the DATA pin. With DVR EN high (Logic 1), the driver output pin, DOUT, is controlled by the VTT EN pin and can be toggled between the voltage value applied at VTT, and a high impedance state. With DVR En* low (Logic 0), DOUT can be toggled between the voltage values applied to the VL and VH pins by using the DATA input pin.
VH, VL, and VTT VH, VL, and VTT define the logical "1", "0", and "termination" levels of the driver and can be adjusted anywhere over the range spanned by VCC to VEE. There is no restriction between VH, VL, and VTT, in that they can all vary independently over the entire voltage range determined by the power supply levels. The VH, VL, and VTT inputs are unbuffered in that they also provide the driver output current, so the sources of these voltages must have ample current drive capability. While VTT is referred to as the termination voltage, it may also be used as a very high "programming" level on many memory devices.
Table 1.
2005 Semtech Corp., Rev. 6, 2/28/05 4 www .semtech.com
Edge211
TEST AND MEASUREMENT PRODUCTS Circuit Description (continued)
Driver Output Protection The Edge211 is designed to operate in a functional testing environment where a controlled impedance (typically 50 Ohms) is maintained between the pin electronics and the DUT. In general, there will be an external resistor at the driver output which series terminates the transmission line to the DUT. In this environment, the driver can withstand a short to any legal DUT voltage for an indefinite amount of time. In a low impedance application with no additional output series resistance, care must be exercised and systems should be designed to check for this condition and tristate the driver if a short is detected. The driver does NOT have on-chip short circuit protection or limitation circuitry.
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Edge211
TEST AND MEASUREMENT PRODUCTS Application Information
Power Supplies Decoupling A .1 F capacitor is recommended between VCC and VEE. In addition, solid VCC and VEE planes are recommended to provide a low inductance path for the power supply currents. These planes will reduce any inductive supply drops associated with swtiching currents on the power supply pins. If solid planes are not possible, then wide power busses are preferable. Latchup Protection The Edge211 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. VCC must remain greater than or equal to VDD (external supply for the digital logic) at all times. Both VCC and VDD must always be positive (above ground), and VEE must always be negative (at or below ground). The three diode configuration shown in Figure 2 should be used on a once-per-board basis.
VH, VL, and VTT Decoupling
VCC
As the VH, VL, and VTT inputs are unbuffered and must supply the driver output current, decoupling capacitors for these inputs are recommended in proportion to the amount of output current the application requires. In general, a surge current of 50 mA (5V swings series terminated with 50 into a 50 transmission line) are the maximum dynamic output currents the driver should see. The decoupling capacitors should be able to provide this current for the duration of the round trip time between the pin electronics and the DUT, and then recharge themselves before the next such transition would occur. Once this condition is satisfied, the VH, VL, and VTT supply voltages are more responsible for establishing the DC levels associated with each function and recharging the capacitors, rather than providing the actual dynamic currents required to drive the DUT transmission line. Ideally, VH, VL, and VTT would each have a dedicated power layer on the PC board for the lowest possible inductance power supply distribution. Power Supply Sequencing The following sequence should be used when powering up the Edge211. 1. 2. 3. 4. VCC VEE Analog inputs (VH, VL , VTT) Digital inputs (VTTEN, DVREN, DATA)
VDD 1N5820 or Equivalent
External System Ground
VEE
Figure 2. Power Supply Protection Scheme
gure 5. Warning: It is extremely important that the voltage on any device pin does not exceed the range of VEE -0.5V to VCC +0.5V at any time, either during power up, normal operation, or during power down. Failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. Even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability.
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Edge211
TEST AND MEASUREMENT PRODUCTS Package Information
TOP VIEW
4
PIN Descriptions
D
D/2
3 e
b E 4
N / 4 TIPS 0.20 C 4X A-B D
E/2 SEE DETAIL "A"
BOTTOM VIEW
5 D1
7
D1 / 2
E1 / 2
5
7
E1
C
OO
4X
0.20
H
A-B
D
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Edge211
TEST AND MEASUREMENT PRODUCTS Package Information (continued)
DETAIL "A"
DETAIL "B"
3 e/2
- 0.05 S A2 DATUM PLANE -H- 0 MIN.
0.08 / 0.20 R. 0.25 GAUGE PLANE
b
A1
C.08 R. MIN. 0.20 MIN. L 1.00 REF.
0-7
SECTION C-C
8 PLACES 11 / 13
A
0.05
-H-
2
//
0.10 C 0.09 / 0.20
ccc -C- M SEE DETAIL "B"
;;; ;;;
9 ddd b b 1
M C A-B S
DS
WITH LEAD FINISH
0.09 / 0.16
Lead Cross Section
BASE METAL
Notes: 1. All dimensions and tolerances conform to ANSI Y14.5-1982. 2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and -D- to be determined at centerline between leads where leads exit plastic body at datum plane -H-. 4. To be determined at seating plane -C-. 5. Dimensions D1 and E1 do not include mold protrusion. 6. "N" is the total # of terminals. 7. These dimensions to be determined at the datum plane -H-. 8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. 10. Controlling dimension: millimeter. 11. Maximum allowable die thickness to be assembled in this package family is 0.30 millimeters. 12. This outline conforms to JEDEC publication 95, registration MO-136, variations AC, AE, and AF.
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A A1 A2 D D1 E E1 L M N e b b1 ccc ddd
JEDEC VARIATION All Dimensions in Millimeters AC Min. Nom. Max. Note 1.60 0.05 0.10 0.15 1.35 1.40 1.45 9.00 BSC. 4 7.00 BSC. 7,8 9.00 BSC. 4 7.00 BSC. 7,8 0.45 0.60 0.75 0.15 32 0.80 BSC. 0.30 0.37 0.45 9 0.30 0.35 0.40 0.10 0.20
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Edge211
TEST AND MEASUREMENT PRODUCTS Recommended Operating Conditions
Parameter Positive Analog Power Supply Negative Analog Power Supply Total Analog Power Supply Junction
Symbol VCC VEE VCC - VEE Tj
Min 6 -5 9
Typ
Max 12 -3 12 +125
Units V V V
o
C
Absolute Maximum Ratings
Parameter Total Analog Power Supply Positive Analog Power Supply Negative Analog Power Supply Analog Input Voltages Digital Inputs Ambient Operating Temperature Storage Temperature Junction Temperature Soldering Temperature TJ TA Symbol VCC - VEE VCC VEE Min 0 0 -6 VEE - .5 VEE - .5 -55 -65 Typ Max 13 13 0 VCC + .5 VCC + .5 +125 +150 +150 260 Units V V V V V
oC o o o
C C C
Stresses above listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Edge211
TEST AND MEASUREMENT PRODUCTS DC Characteristics
Driver Characteristics
Parameter Programmable Driver Output Voltages Driver Output Swing Symbol VH, VL, VTT VH - VL VH - VTT VTT - VLL Iout DC Iout AC Rout - HI Rout - VTT Rout - LOW Cout Ileak VOS -100 -(.5% + 5) Min VEE VEE - VCC VEE - VCC VEE - VCC -50 -220 21.6 22.3 22.3 23.6 24.3 24.3 13 0 4 +100 +(.5% + 5) Typ Max VCC VCC - VEE VCC - VEE VCC - VEE +50 +220 25.6 26.3 26.3 Units V V V V mA mA pF nA mV mV
DC Driver Output Current AC Driver Output Current Output Impedance VH (@ +3.0V) (Note 3) VTT (@ +1.5V) (Note 3) VL (@ 0.0V) (Note 3) DUT Pin Capacitance (Driver Off) High Impedance Leakage Current (Note 1) VH / VL / VTT Offset Voltage (Note 2) VH / VL / VTT Gain and Linearity Error (Note 2) Power Supply Positive Supply Current Negative Supply Current Total RMS Supply Current @ 80 MHz AC + DC Positive Supply Current AC + DC Negative Supply Current (Note 1)
ICC IEE
23 23
32 32
mA mA
70 70
mA mA
Note 1: This parameter is guaranteed by design and characterization. Production testing is performed against a 250 nA limit. Note 2: No load conditions. Note 3: Tester min / max limits set to Typ 2.0. Tester repeatability = .8. Digital Inputs DATA, DVR EN*, VTT EN
Parameter Input High Voltage Input Low Voltage Input Current Digital Input Voltage Range Symbol INPUT - INPUT* INPUT* - INPUT IIN INPUT, INPUT* -2.0* Min 800 800 0 1.0 +5.0 Typ Max Units mV mV A V
* -2V or (VEE + 2.0V), whichever is more positive.
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Edge211
TEST AND MEASUREMENT PRODUCTS AC Characteristics
Parameter Propagation Delay DATA IN to DOUT DVR EN* to DOUT (Active to HiZ) (Note 2) DVR EN* to DOUT (HiZ to Active) (Note 4) Minimum Pulse Width (3V Swing) Toggle Rate DOUT Output Rise/Fall Times (Note 1) 1V Swing (20% - 80%) 3V Swing (10% - 90%) 5V Swing (10% - 90%) Driver Temperature Coefficient Driver Edge to Edge Matching Tpd vs. Pulse Width (Note 3) I/O Voltage Spike Overshoot / Undershoot
Symbol
Min 7 7 7
Typ 11 11 11 4
Max 14 14 15 5
Units ns ns ns ns MHz
Fmax
100
1.0 1.3 1.4 Tpd/T <25 <500 <100 -500 - (3% + 50)
1.6 3.0 4.0
ns ns ns ps / oC ps ps
500
mV
+ (3% + 50) %Swing + mV
Note 1: Note 2: Note 3: Note 4:
Into 18 cm of 50 transmission line terminated with 1K and 5 pF with the proper series termination resistor. Measured at a voltage change of 500 mV with a 30 mA load. (VH = +5V, VL = 0V) Tested with an input pulse of 20 ns, 30 ns, and 80 ns. T = 100 ns. 4 mA load current.
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Edge211
TEST AND MEASUREMENT PRODUCTS Ordering Information
Model Number
Package
E211ATF
32-Pin TQFP
EVM211ATF
Edge211 Evaluation Module
Contact Information
Semtech Corporation Test and Measurement Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858)695-1808 FAX (858)695-2633
2005 Semtech Corp., Rev. 6, 2/28/05 12 www .semtech.com

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